OUR SERVICES

Front End Design and Verification

Physical Design and Signoff

Design for Testability

Post Silicon Validation & Emulation

Platform Engineering

XQWave (formerly named as Obsidian Solutions) offers design services focused on supporting companies with their own expertise & ASIC/FPGA design teams to develop ASIC and FPGA based products
XQWave offers an extensive set of Silicon design services focused on supporting semiconductor and systems companies in the delivery of IC, SoC, ASIC or FPGA projects. These services range from a full turnkey solution that delivers a production ready design, to sub-system or IP block development, or having XQWave engineers augment your existing design teams with the right expertise.
Our services can be delivered using the wide range of 3rd party EDA tools in the resource augmentation model or by accessing our customer EDA licenses via VPN. With the right combination skillset and expertise we can form a team that offers the right balance of experience, scale and cost to meet the demands of any project.
Please click on the following Offerings for more details.

Front End Design

XQWave’s Front-End team is experienced in various aspects of RTL design, including the design and development services of chips and systems. Collaborating with architecture teams worldwide, our teams have successfully defined systems architecture and SOC architecture in various domains. Team has developed the complete Register Transfer Language (RTL) for numerous IP blocks and SOC integration. Our team works in collaboration with Physical Design team for performance, power closure and Verification team for the test plans, coverage plans, and coverage closures.
Our Front-End engineering services addresses design and verification challenges for microchips in automotive, networking, communications, AI applications, HPC, IOT and wireless infrastructure devices. Team expertise listed below,
  • Architecture and Micro-architecture specifications
  • RTL development and verification
  • SOC and Sub-system Integration
  • System C Modelling
  • Synthesis, Lint, Constraints, CDC and Low power

Design Verification

Our Verification team can deliver comprehensive turnkey design verification, including complete architecture, test plans, development of new test benches, BFMs, new VIPs, scoreboards, and extensive coverage metrics. Our structured process methodologies for design verification and validation testing effectiveness ensure a bug-free product. Team has expertise in below
  • Architecting complex test benches using OVM, VMM and UVM
  • System based test case development
  • Test planning and scheduling using coverage driven methods
  • Verification from test plan to closure using functional coverage and code coverage
  • Expertise in RISCV and CPU based design. Have working knowledge on PCIE Gen4/5, Ethernet, USB 3.0, OTG, SATA, AMBA, SPI, UART, DDR4/5
  • Scoping and project planning of complex projects

Physical Design and Signoff

With a proven physical design flow, methodologies, and dedicated subject matter experts, we have delivered turnkey/ownership model silicon design services to many clients for successful silicon tape-outs. Our leaders/engineers experienced in Tape outs for Die size ranging from 30mm2 to 600m2, achieving optimal Die Size, Power, Area and Performance. Team has worked with multiple foundries TSMC, Samsung, GF, UMC, Tower and SMIC with technology ranging from 180nm to 3nm nodes. Expertise includes,
  • Floorplan & Placement
  • I/O Ring Planning, Bump planning, and RDL routing
  • Timing optimization, CTS & Routing
  • STA signoff (Block Level and Full Chip)
  • Low Power CLP checks and implementation
  • Power analysis (IR/EM/Signal EM/LP)
  • Physical verification (DRC/LVS and Antenna) signoff
  • ESD checks via Pathfinder or PERC
  • Formal verification (LEC)
  • Checklists signoff and QC checks process

Design for Testability

With rising mission critical application and competition, inserting testing capability in the design stage of the chip is ever so important. Our team have expertise in developing and integrating a complete test strategy for your ASIC design to deliver high fault coverage. Team has expertise in following area,
  • Test architecture
  • Scan & Scan-compression insertion
  • MBIST insertion in RTL and simulation
  • JTAG and BSCAN insertion, working closely with PD and Packaging team
  • RTL | Gate Level | Post-layout simulation
  • ATPG patterns generation | Simulation & diagnostics
  • SDC Test constraint & validation
  • Silicon debug – Bring up support and ATE testing
  • Extensive experience in bringing up chip in ATE and support till production including HTOL, ESD, functional validation in the lab.

FPGA Design

Following are the services offered in FPGA Design with the deep understanding of FPGA based System Designs (Hardware/Software/Firmware). Expertise in – Zync, ARM-based SOCs like MPSoC, PCIe, 10G/25G/40G MACs, DDR, DMA, Peripherals, Xilinx (AMD) & Altera (Intel) FPGAs.
  • FPGA porting feasibility study
  • Architecture & Micro-architecture design
  • RTL coding for FPGA in VHDL and Verilog & Optimization
  • Custom IP development for FPGA and integration
  • Hardware-Software partitioning
  • FPGA Synthesis and Implementation for Area and Timing
  • Timing Closure
  • FPGA prototyping of ASIC Sub-system/Designs into one or more FPGAs
  • FPGA porting: FPGA-to-FPGA, ASIC-to-FPGA
  • Industry Standard FPGA Testbench architecture, verification & coverage
  • FPGA debugging using DMA based data capture, ILAs
  • Validation and Bringup

Post Silicon Validation & Emulation

Coming Soon…

Analog Circuit Design & Layout

Coming Soon…

Embedded Software

Coming Soon…
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